甲基磺酸盐体系电镀铅–锡–铜合金工艺

Lead–tin–copper alloy electroplating process in methanesulfonate electrolyte

研究了甲基橫酸盐体系电镀Pb-Sn-Cu三元合金工艺参数对镀层成分和外观的影响，确定了最佳的工艺条件：Pb^2＋95-105 g/L, Sn^2＋9-13g/L, Cu^2＋2-3g/L,曱基磺酸 140g/L,添加剂A3-5g/L,添加剂B 6-7 g/L,电流密度2.5 A/dm^2,温度19-23 ℃。在此工艺下以不锈钢片为基材镀Pb-Sn-Cu合金45 min，所得後层色泽均匀，结晶细致，膜层厚度为11.2μm，镀层中Sn含量为7.44%-7.52%，Cu含量为2.19%-2.26%，符合Pb-Sn-Cu三元合金镀层成分的要求。

The effects of process parameters oncomposition and appearance of Pb-Sn-Cu ternary alloycoating electroplated from a methanesulfonate electrolytewere studied. The optimal process conditions weredetermined in the following： Pb2＋ 95-105 g/L, Sn2＋ 9-13 g/L,Cu2＋ 2-3 g/L, methanesulfonic acid 140 g/L, additive A3-5 g/L, additive B 6-7 g/L, current density 2.5 A/dm2, andtemperature 19-23 ℃. Under these conditions, thePb-Sn-Cu alloy plating was carried out on the surface of stainless steel sheet for 45 min. The coating is 11.2μm thickand compact, has uniform color and luster, and contains Sn7.44wt%-7.52wt% and Cu 2.19wt%-2.26wt%, meeting the composition requirement of Pb-Sn-Cu ternary alloy coating.