用银油墨打印及化学镀铜法制备印制电路板电路图形

Preparation of circuit pattern for printed circuit board by silver ink printing and electroless copper plating

先在普通打印机上把线路图用纳米银导电油墨打印在聚酰亚胺基板上,再通过化学镀铜制得印制电路板。研究了化学镀铜时间对沉积速率的影响,以及银导电油墨的固化温度对铜镀层耐磨性、附着力、厚度、电阻率等性能的影响。施镀时间为40min时,化学镀铜的沉积速率最大(为13.58μm/h)。银导电油墨的适宜固化温度为300℃,对应的铜镀层电阻率最小(为1.889×107/m),耐磨性和附着力最佳。

Printed circuit board was prepared by printingcircuit pattern on polyimide substrate with conductivenano-silver ink using common printer followed byelectroless copper plating. The effect of electroless copperplating time on the deposition rate were studied, and theeffect of curing temperature of conductive silver ink on theproperties of copper coating,such as wear resistance,adhesion strength, thickness, and resistivity, were studied.The deposition rate of electroless copper plating is maximum（13.58 μm/h） when plating time is 40 min. The suitablecuring temperature of conductive silver ink is 300 ℃, andthe copper coating obtained thereafter has minimum resistivity,best wear resistance,and highest adhesion strength.