摘要
在无线产品基站收发信单板生产中,生产测试筛选出不良单板,经切片故障定位,问题是单板上特定位置BGA芯片的固定管脚发生断裂造成。从单板BGA设计、BGA焊球成分和单板各生产工序等几个方面对问题进行深入剖析,运用机械应力检测和应力软件仿真等可靠性检测模拟设备和软件方法,对微应变问题解决提出了一系列的改进措施,彻底解决了BGA应力可靠性问题。
Undesirable assemblies were sifted by test during the production of radio base station transceiver.there is a BGA pin-cracking in permanent position after default locating.Elaborate the ways revolving problems from in-process inspection,shape design of board,ball components of the BGA.Introduce the stress simulation tool and stress testing application.Put forward a series of improvement measures,and completely solve the BGA stress reliability the problem.
出处
《电子工艺技术》
2013年第3期136-141,共6页
Electronics Process Technology
