摘要
功放印制基板与散热底座或壳体间必须具有良好的接地和散热效果。探讨了为了满足功放功率输出特性好和效率高的设计性能要求,在制造环节应采取的有效工艺控制措施。并对4种功放印制基板和散热底座材料选择以及功放印制基板和散热底座连接回流焊接技术等进行了介绍。经过工艺试验、电性能测试以及环境试验,验证了工艺方案的正确性。
Good grounding and cooling effect must be had between amplifier printed circuit board and heat sink base or shell.The effective process control measures were discussed in production in order to achieve the output performance of the amplifier power and high efficiency performance.The 4 types of PCBs of Microwave Power Amplifier were taken as examples,the choice of PCB and heat sink material,and the reflow soldering technology between PCB and heat sink were introduced.The correctness of the solution was verified by process test,electrical performance test and environment test.
出处
《电子工艺技术》
2013年第3期161-166,共6页
Electronics Process Technology
关键词
微波功率放大器
接地
散热
回流焊接
Microwave power amplifier
Grounding
Thermal solution
Reflow soldering
