多温度梯度焊接工艺技术

Soldering Technology of Multiple Temperature Gradient

射频微波模块中,涉及复杂的各种射频基板、射频部件、器件和I/O等的安装,由于高频微波电路对射频接地和散热等有特殊要求,故微波组件采用的传统螺装方式已无法满足高频微波射频电路性能要求。针对这种工程应用需要,探讨了多温度梯度焊接工艺技术,介绍了梯度焊接不同温度焊膏的选择依据和多温度梯度焊接的前期准备工艺,并对多温度梯度焊接的工艺过程进行了描述,通过实验,论证了多温度梯度焊接工艺的优势及对微波电路性能的提高。

RF module involves complicated installation for various RF substrate,RF components,devices and I/O,because of especial request to RF grounding soldering and cooling,so traditional assemble mode by bolt fixing is not suitable for high frequency circuit.The soldering technology of multiple temperature gradient is expounded.Selecting different temperature solder paste and preparing process before soldering are introduced.Through the experiment,it is demonstrated that the temperature gradient soldering technology improve the microwave circuit performance.