摘要
本文利用旋转圆盘电极上的循环伏安溶出法研究两种光亮镀镍添加剂在不同电流密度下的整平能力.实验表明,在电位扫描时可能出现负滞环或正滞环,这取决于电极的旋转和添加剂的种类;讨论了出现滞环的原因.添加剂在低电流密度下的整平能力看来与其在电极上的扩散控制性消耗有密切关系.
The levelling power of two additives for bright nickel plating was investigated at various current density by CVS at a rotating disc electrode. Experiments showed that a negative or positive hysteresis may appear during potential scanning, depending on rotation and additives. The reasons for this were discussed. The levelling power of an additive at low current density seems to be closely connected with its diffusion-controlled consumption at electrode.
出处
《电镀与涂饰》
CAS
CSCD
1991年第1期18-20,共3页
Electroplating & Finishing