摘要
综述了镍电沉积机理,并介绍Hoare提出的硼酸作为催化剂作用的新观点.讨论了阴极电流密度对镀镍添加剂的吸附和消耗量的影响,阐述了镀镍组合光亮剂的不可缺少的其它成份.
The mechanism of electrodeposition of nickel was reviewed. The new view point proposed by Hoare that boric acid acting as a catalyst in nickel plating baths was introduced. Effects of cathodic current density on both the adsorption and the consumption of additives were discussed. Also some essential ingredients for nickel plating additives were described.
出处
《电镀与涂饰》
CAS
CSCD
1991年第1期2-9,共8页
Electroplating & Finishing
