摘要
根据硫脲的化学性质,讨论了硫脲的缓蚀效应、稳定效应、络合效应以及抛光效应.介绍了17种含硫脲的槽液配方,提出使用硫脲时应注意的问题.
The inhibiting, stabilizing, complexing apd polishing actions of thiourea in electroplating solution were described based on the chemical properties of thiourea. Seventeen baths containing thiourea were listed. Several points which should be noticed on employing thiourea were pointed out.
出处
《电镀与涂饰》
CAS
CSCD
1991年第2期45-51,共7页
Electroplating & Finishing
