瞬时液相扩散焊接CuAlBe合金和1Cr18Ni9Ti不锈钢

Transient Liquid Phase(TLP)Diffusion Bonding of Copper Alloy to Stainless Steel Using CuMu Alloy as Interlayer

采用CuMn合金为中间层对CuAlBe合金和 1Cr18Ni9Ti不锈钢进行了瞬时液相扩散焊接。通过扫描电镜、电子探针和X射线衍射分析等手段对接头的微观组织和相结构进行了分析 ,并用拉伸试验评价了接头的连接强度。研究结果表明 ,焊接压力、焊接温度、焊接时间及CuMn合金中间层Mn的含量等焊接参数对接头强度影响很大。在本试验中 ,当CuMn中间层中Mn元素含量为 30 %、Tb=12 2 3K、tb=40min、P =1MPa时接头强度最高达到 487MPa ,其断口是韧性断裂。通过分析Mn的作用机理 ,发现Mn元素能够显著改善晶界结构 ,从而提高接头的连接强度。

The transient liquid phase diffusion bonding of Cu alloys(CuAlBe)to stainless steel(1Cr18Ni9Ti)with CuMn alloy as interlayer was carried out.The kinds of the reaction products and the interface structures of the joints were investigated by SEM,EPMA and XRD.The results show that bonding pressure,bonding time,bonding temperature and the content of Mn in CuMn alloy had great effect on the strength of joints.When they were 1MPa,40min,1223K and 30wt% respectively the joint strength was up to 487MPa,the fracture of which was a plastic one.In this paper,the effect of Mn in CuMu interlayer was analyzed.It was found that the structure of interface and the strength of joints were improved greatly by the element Mu of CuMn alloys.