摘要
钻削过程中,主运动与进给运动结合,去除切削层,生成切屑并形成新的工件表面。在局部高温和高压条件下,不断变化着的3表面:已加工表面,加工表面,待加工表面,存在着机械、物理和化学作用。通过有限元技术建立基于热-力多物理场耦合理论的钻削加工印刷电路板中铜箔材料表面创成模型;并对加工过程的多种特征进行了仿真;分析钻削加工中钻削力、钻削温度的动态变化规律;仿真显示:直径3.2mm钻头在20 K/r/min主轴转速和1000mm/min进给速度的切削条件下,其轴向力和扭矩信号呈双峰形状,钻削铜的最大轴向力62N,最大扭矩0.044N.m,切削区的温度为200℃左右;仿真结果和PCB钻孔实测结果基本吻合。
The main movement is combined with feed movement,and removes the workpiece on the drilling to produce chips,and the formation of a new surface.On local temperature and pressure conditions,the three changing surfaces:the machined surface,the machining surface,the surface is to be processed,and there is a mechanical,physical and chemical effects.The mechanism of the creation of holes is verified by the finite element technology.Based on thermo-mechanical coupling theory,model can be applied to drilling printed circuit board(PCB)which is consists of thin copper foil.It shows:for 3.2mm drill,20 K/r/min spindle rotation and feed of 1000mm/min,the torque reaches 0.044N.m,and thrust is 62N.Experiments have verified that the model predicts the temperature field and drilling thrust and torque for a range of drill geometry.
出处
《机械设计与制造》
北大核心
2013年第3期165-168,共4页
Machinery Design & Manufacture
基金
上海市宝山区科学技术委员会的资助(CXY-2012-18)
