硅片切割张力控制策略研究

Research the Strategy of Tension Control on Wafer Cutting

对硅棒的切片加工技术进行了简介,分析了切割线在走线过程中张力波动产生的原因。提出基于伺服电机转矩控制和张力摆杆相结合的张力控制方案来替代现有的张力重锤控制方案,并建立了该控制方案运动学模型和动力学模型,为张力反馈控制提供了理论依据。通过建立速度控制模式下伺服电机的数学模型,提出模型参考自适应速度同步控制方案与张力摆杆的反馈相结合的张力控制策略。在MATLAB/Simulink仿真环境下分别建立基于PID控制策略和自适应控制策略的张力控制系统仿真模型,仿真结果表明该控制方案明显优于PID控制方案,能够有效控制线速度同步误差和张力波动。

It has a brief introduction of silicon rods＇ slice processing,and analyzed the reason that caused the fluctuation of the tension during the processing.Proposed a mechanical and electrical integration of the tension control program based on the servo motor combined with the tension pendulum to replace the traditional tension hammer control program,and established the kinematic equation and the kinetic equation of this program that provide a theoretical basis for the feedback control of tension.It established the mathematical of the servo motor under the speed control mode,designed speed synchronous model reference adaptive control scheme,and combined with the feedback from the tension pendulum to have a control on tension fluctuation.It built the simulation models in MATLAB/Simulink based on PID control method and adaptive control method,and the simulation results show that this method have obvious advantages than PID control method,which can effectively control the error of speed synchronization and the tension fluctuation.