单晶金刚石机械研磨结合化学辅助机械抛光组合加工工艺

Compound Processing Technique for Single Crystal Diamond with Mechanical Lapping and Chemically Assisted Mechanical Polishing

单晶金刚石因具有最高的硬度和最低的摩擦系数常被用来制备超精密刀具,而表面粗糙度是影响刀具寿命的重要指标.提出采用机械研磨结合化学辅助机械抛光的组合工艺抛光单晶金刚石.实验优化并确定的加工工艺如下:先用5μm和2μm金刚石粉研磨单晶金刚石表面,然后采用化学机械的方法去除机械研磨带来的损伤.用该工艺抛光单晶金刚石,表面粗糙度Ra可达0.8 nm(测量区域70μm×53μm).表面拉曼光谱分析表明化学机械抛光的表面只有1 332 cm-1拉曼峰.

Single crystal diamond is often used to be made into uhra-precise cutting tool for its highest hardness and lowest friction coefficient. Surface roughness is an important requirement for tool life. This paper presents a method for processing single crystal diamond, which integrates mechanical lapping with chemically assisted mechanical polishing. The optimized processing is to first obtain a plane by lapping using 5 p^m and 2 ~m diamond powders and then remove the damage caused by lapping with chemically assisted mechanical polishing. A surface roughness, Ra = 0. 8 nm（ measured area 70 μm× 53 μm） , can be achieved by using this machining process. Moreover, the analysis results with Raman spectrometer in- dicate that a surface with only 1 332 cm-1 Raman peak can be obtained using chemically assisted me- chanical polishing.