摘要
The electroless copper deposition on both pure and Cr-coated diamond particles was stud- ied to produce copper/diamond composites for electronic packaging materials. The particles were characterized and the mechanism of product formation was investigated through scanning electron microscopy （SEM）, energy dispersive spectroscopy （EDS）, X-ray diffraction （XRD）, and X-ray photoelectron spectra （XPS）. The particle coating thickness was measured using optical micro- graphs. The diamond particles got uniform coating thickness of copper crystals layers. This method provided an excellent base for the fabrication of metal-based composites using cheap equipments, and was less time consuming, nature friendly and economical compared with other methods of dia- mond surface metallization.
The electroless copper deposition on both pure and Cr-coated diamond particles was stud- ied to produce copper/diamond composites for electronic packaging materials. The particles were characterized and the mechanism of product formation was investigated through scanning electron microscopy （SEM）, energy dispersive spectroscopy （EDS）, X-ray diffraction （XRD）, and X-ray photoelectron spectra （XPS）. The particle coating thickness was measured using optical micro- graphs. The diamond particles got uniform coating thickness of copper crystals layers. This method provided an excellent base for the fabrication of metal-based composites using cheap equipments, and was less time consuming, nature friendly and economical compared with other methods of dia- mond surface metallization.
