4种自酸蚀粘接系统对正常牙本质和龋损影响牙本质粘接效果的比较

Comparison of the bond strength of four self-etching adhesives bounded to normal dentin and caries-affected dentine

目的:比较4种第七代自酸蚀粘接系统对正常牙本质(normal dentin,ND)和龋损影响牙本质(caries-affected dentin,CAD)的粘接强度。方法:选取24颗面龋损的人离体磨牙,在龋损引知液(Voco)的监控下去除龋损,在远中面健康牙本质预备至龋洞深度窝洞。随机将去龋磨牙分成4组,分别用4种第七代粘接系统(AdperTMEasy One;I Bond;Clearfil S3 Bond;G Bond)按照使用说明进行粘接,并用树脂(Filtek P60)修复后沿牙长轴方向将树脂和牙齿从颊舌侧方向片切,厚度为1.0mm,并修整成粘接面(ND和CAD)面积为1 mm2的试件,进行微拉伸实验,并用扫描电镜观察粘接面形态。结果:I Bond粘接ND时粘接力明显强于CAD(P<0.01)。其他3种粘接系统在ND中也产生较高粘接强度(P<0.05)。粘接CAD时4种粘接剂强度差异不明显(P>0.05)。扫描电镜观察,混合层在CAD上表现得较厚,较疏松,形成的树脂突较少。结论:4种自酸蚀粘接系统在ND的粘接力强于在CAD上的粘接力,用于CAD时粘接效果无差异。

Objective：To evaluate the microtensile bond strength of four self-etching adhesives of the 7th generation bonding system bounded to normal dentin（ND） and caries-affected-dentine（CAD）.Methods： 24 extracted human molars with coronal medium carious lesion were randomly divided to 4 groups.The softened carious dentine was removed with a slow-speed,carbon-steel bur to expose CAD and Caries Marker（Voco） was used as a guide.The ND was exposed on each tooth as the control.ND and CAD were bonded with self-etching adhesives Adper^TM Easy One,I Bond,Clearfil S3 Bond and G bond respectively.The crowns were built up using resin composite Filtek P60.Rectangular sticks with resin-dentin bonded interface of 1.0 mm2 were prepared.The specimens were subjected to microtensile bond strength（μTBS） testing.Interface morphology was observed by scanning electron microscopy（SEM）.Results： I Bond showed significantly higher bond strength in ND than in CAD（P〈0.01）.The other 3 bonding systems also produced higher bond stregth in ND than in CAD（P〈0.05）.All the adhensives attained the similar strength in CAD（P〈0.05）.SEM images showed that the hybrid layer in CAD was thicker and more porous than that in normal dentine.There was fewer resin tag exhibited in CAD than in ND.Conclusion： The 4 self-etching adhesives may produce higher bond strengths in ND than in CAD.All the adhensives attain similar bond strength in CAD.