晶片行星式研磨抛光机运动模拟研究

A Study on the Motion Simulation of Crystal Plate Type Grinding Polisher

针对单晶硅片高精度研磨抛光中存在的问题 ,从摩擦学理论出发计算模拟了磨粒平均相对速度、研磨盘磨损的变化过程 ,揭示了运动参数对研抛的表面质量、纹理方向的影响规律 。

In accordance with the problems in high precision grinding of monocrystalline silicon piece and from tribology theory,we calculate the velocity which simulate the average relative velocity of abrasive particles and the abrasion variance course of abrasive disk and reveal the rule of movement parameters' influence on the work piece quality and texture direction,which has general meaning for the rational choice of subindividual grinding polisher and motion parameters.