亚微米电解加工的试验研究

Experimental study on submicron electrochemical machining

为了增强Ag纳米线在亚微米电解加工中的稳定性,对其表面溅射金属Au.Ag纳米线的稳定性试验结果表明,溅射层越厚,Ag纳米线在电解加工环境中的稳定性越好,但是过厚的溅射层会使纳米线发生弯曲.当溅射层厚度约为55 nm时,溅射层不够致密,电解加工时亚微米工具电极会发生溶解;当溅射层厚度约为310 nm时,溅射层的内应力过大,亚微米工具电极出现弯曲.因此,采用溅射层厚度约为150 nm的亚微米工具电极进行亚微米电解加工.在浓度为0.1mol/L的H2SO4电解液中,施加电压为4 V、周期为50 ns、脉宽为6 ns的纳秒脉宽脉冲电流,于高温合金试件表面成功加工出亚微米沟槽,沟槽长约30μm,深约80 nm,底部最窄处约为450 nm,入口最宽处约1μm.

In order to improve the stability of Ag nanowires in submicron electrochemical machining,Au is sputtered on the surface of Ag nanow ires.The results of stability experiments of Ag nanow ires show that the stability of Ag nanow ires increases w ith the increase of the thickness of sputtering layer.How ever,w hen the sputtering layer is too thick,Ag nanow ires are bent.When the thickness of the sputtering layer is about 55 nm,the submicron tool electrode dissolves in electrochemical machining due to loose sputtering layer,w hile it is bent because of large internal stress w hen the thickness of the sputtering layer is about 310 nm.Therefore,the submicron tool electrode w ith the thickness of the sputtering layer of about 150 nm is appropriate to submicron electrochemical machining.In the electrolyte w ith 0.1 mol/L H2SO4,by using the pulse generator with 50 ns in period,6 ns in pulse on-time and 4 V in voltage,a submicron groove w ith the length of 30 μm,depth of 80 nm,minimum bottom w idth of 450 nm and maximum entrance w idth of 1 μm is prepared successfully in the surface of high-temperature-alloys w orkpiece.