浅谈合金电镀以及其发展趋势

On Alloy Plating and Its Development Trend

合金电镀具有热熔合金和单金属镀层无法比拟的优点。随着我国合金电镀工艺水平的不断提高,合金电镀下游行业包括机械工业、五金、家电、电子等行业都在不断快速发展,为合金电镀行业提供了广阔的市场空间。本文简要介绍了合金电镀的特点、共沉积的条件以及类型,并且介绍了其发展趋势。

Alloy plating has incomparable advantages over hot melting alloy and single-metal alloy.With the constant improvement of alloy plating techniques in China,the downstream industry of alloy plating including mechanical industry,hardware,appliances,electronics and so on are developing rapidly,which provides a broad market for the alloy electroplating industry.This article briefly introduces the characteristics of alloy plating,conditions and types of codeposition and the development trend.