一种带SIR结构的微带宽带双频合路器设计

Design of Microstrip Broadband Dual-band Combiner Based on SIR

针对传统同轴腔体双频合路器使用谐振腔耦合级联的方式,导致合路器结构复杂,装配调试难度大,体积大,成本高等缺点。本文提出了一种带SIR结构的微带宽带双频合路器设计方案。该方案采用在盒体内固定一个介质基板,介质基板上设置一个低通滤波器和一个带阻滤波器将其进行合路。其中,带阻滤波器采用SIR结构。可使实物尺寸减小。实验测量结果与仿真结果基本吻合,结果表明该新型结构可使通带之间有较高的隔离度,具有小尺寸、插损低,易生产和易调试等优点。

In view of problem that coaxial-cavity dual-band combiner couples by resonator,which causes that the structure of combiner is complex,the assembly and debugging is difficult,bulky,and high cost.This paper proposes a designing scheme of microstrip broadband dual-band combiner based on SIR.In the box,a dielectric substrate is fixed,on which a die low-pass filter and a band stop filter based on SIR are used to combine.The physical size can be reduced.Experimental results and simulation results are basically consistent with each other.The results show that the new structure allows passband to have high isolation,and it has the advantages,such as smaller volume,lower insertion loss,being easier to manufacture and test.