超支化聚苯基硅树脂改性封装用环氧树脂研究

Research of Hyper Branched Polyphenyl Silicone Resin Modified Epoxy for Electronic Packaging

文中通过合成超支化的聚苯基硅树脂体系,对环氧树脂进行改性,以提升其介电、耐湿、耐热和力学性能。研究表明,超支化聚苯基硅树脂体系（HBPSi）的加入量在0~10wt%时,改性后的树脂体系介电、耐湿、耐热和力学性能随着HBPSi增加而提升;而在大于10wt%时,其性能的提升减缓。产生这种结果主要归因于一方面HBPSi与EP中的羟基反应,消耗了环氧树脂体系的羟基,另一方面是引入了大量的柔性硅氧链节。

In this paper,a novel hyperbranched phenyl silicone resin（HBPSi）was prepared,which was used to modify Epoxy resin（EP）.Tests results showed that when the contents of HBPSi were in the range of 0~10wt%,modified EP presents better properties as contents raise more;when the contents were more than 10wt%,properties of Epoxy resin increased slowly.This result is mainly attributed to the reaction of HBPSi and hydroxyl of EP,at the same time,Number of silicon-oxygen chains were grafted to the EP.