高速光调制器的发展与封装技术研究

Research on Development and Packaging of High-frequency Optical Modulator

文章分析了100 Gbps(以下简称100 G)以太网光通信光调制器及其封装的技术发展动向,对比分析了10 G/40 G/100 G高速光调制器及其封装的结构特点。通过对高速光调制原理的浅析,论述了40 G/100 G高速光调制器在100 G系统中的重要性。以一款40 G高速光调制封装为例,剖析了光调制器封装结构、关键技术及其工艺路径,以及封装在光调制器中的重要性。文末展望了高速光调制器及封装在未来的发展方向。

With coming of 100 G Ethernet Era（100 G is short for 100 Gbps）,this thesis studies on technical development trend of one of key components in optical communication and meanwhile comparatively analyses structures of 10 G/40 G/100 G high-frequency optical modulators as well as their packaging features.By making simple analysis on theory of high-frequency optical modulator,the author speaks of the importance of 40 G/100 G high-frequency optical modulator in 100 G system.Take one type of 40 G high-frequency optical modulator as example,packaging structure,key techniques and processes are mainly discussed and researched in this paper,which emphasizes clearly on importance of packing for optical modulator.At last,this paper looks forward to the future development trend of high-frequency optical modulators as well as their packaging structures.