Super-Band粘接剂降低银汞合金充填体微渗漏作用的研究

THE EFFECT OF SUPER BAND BONDING AGENT ON DECREASING MICROLEAKAGE OF SILVER AMALGAM RESTORATIONS

目的 :研究粘接剂对降低银汞合金充填体微渗漏的作用 ,以评价其在充填治疗中的意义 ,探讨减少银汞合金充填体边缘微渗漏的有效方法。方法 :选择无龋的离体牙 30颗 ,制备相同的洞型 ,随机分成实验组和对照组。实验组在牙洞各壁先涂上Super Band粘接剂后再用银汞合金充填 ,对照组不涂粘接剂而直接用银汞合金充填。用染色渗入法比较两组间的微渗漏情况。结果 :实验组银汞合金充填体的边缘微渗漏明显低于对照组 (P<0 .0 1 )。结论

Objective:To study the effect of super band bonding agent on decreasing microleakage of silver amalgam restorations and to evaluate the application values of the agent.Methods:30 non carious extracted molars were selected and randomly divided into two groups,and similar cavities were made in each molar.Dye penetration method was used to compare the extents of microleakage between the two groups.Results:There was a significant difference in the extents of microleakage between the two groups( P <0.01).Conclusion:Super band bonding agent could remarkably decrease the microleakage of silver amalgam restorations.