甲基苯基有机硅低聚体改性环氧树脂的韧性及热残重

Toughness and Solid Residue of Epoxy Resins Modified by Methyl Phenyl Silicone Oligomer

以二甲基二乙氧基硅烷、甲基三乙氧基硅烷、苯基三乙氧基硅烷为单体原料,通过水解、缩聚的方法合成了甲基苯基有机硅低聚体(PMPS)。然后用其与双酚A型环氧树脂(E51)发生共聚反应,并且引入柔性环氧树脂(DER732),制备出一系列PMPS改性环氧树脂。红外光谱表明,PMPS接枝在环氧树脂上。探讨了PMPS含量对改性树脂拉伸强度、断裂伸长率、冲击强度、微观形貌、热残重的影响。结果表明,当m(E51)∶m(DER732)∶m(PMPS)=40∶20∶40时,改性树脂的断裂伸长率为49.63%,冲击强度为12.07 kJ/m2,600℃的热残重为27.19%,分别比未改性的环氧树脂提高了42.78%,8.41 kJ/m2和21.83%。

The methyl phenyl silicone oligomer was synthesized by hydrolysis-polycondensation method from methyl triethoxysilane,dimethyl ethoxysilane and diphenydiethoxysilane monomer.Bisphenol A epoxy resin（E51） was modified by PMPS and flexible epoxy resin（DER732）,a series of PMPS-modified epoxy resins were prepared.IR spectra indicate that PMPS was incorporated onto epoxy resin.The influences of contents of PMPS on the materials were investigated via measuring tensile strength and elongation at break,microstructure and solid residue of the cured materials.The results show that when m（E51）∶m（DER732）∶m（PMPS）=40∶20∶40,the elongation at break,impact strength,residual yield at 600 ℃ are 49.63%,12.07 kJ/m2 and 27.19% respectively,higher than those of pure epoxy resins by 42.78%,8.41 kJ/m2 and 21.83% respectively.