期刊文献+

挠性覆铜板用无卤阻燃胶粘剂的研制 被引量:2

Development of halogen-free flame-retardant adhesive for flexible copper clad laminates
下载PDF
导出
摘要 采用端羧基丁腈橡胶对环氧树脂增韧改性,以4,4′-二氨基二苯砜为固化剂、1-氰乙基-2-乙基-4-甲基咪唑为固化促进剂,运用磷阻燃机制和成碳阻燃技术,研制出一种挠性覆铜板用无卤阻燃胶粘剂。利用DSC、TGA分别表征胶粘剂的固化反应性和成碳率,探讨了胶粘剂的增韧、固化和阻燃机理。试验结果表明,该无卤阻燃环氧阻燃胶粘剂具有优良的柔软性、粘接性、耐热性和阻燃性,适用于制作挠性覆铜板。 In this paper,a halogen-free flame-retardant adhesive for the flexible copper clad laminates (FCCL) was prepared by using the flame-retardant mechanism of phosphorus and the flame-retardant technology due to char formation,and the epoxy resin was toughened with carboxyl terminated butadiene acrylonitrile rubber (CTBN),and using 4,4'-diamino diphenyl sulfone (4,4' -DDS) as the curing agent and 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ- CN) as the curing accelerant.The curing reactivity and char yield of the adhesive were characterized by differential scanning calorimetry (DSC) and thermogravimetry analysis (TGA).The mechanism of toughening,curing and flame-retarding of the halogen-free flame-retardant adhesive were investigated.The experimental results show that the halogen-free flame- retardant adhesive has excellent flexibility,adhesive properties,heat resistance and flame retardancy,and so that it is suitable to make the flexible copper clad laminates.
出处 《粘接》 CAS 2013年第8期34-38,共5页 Adhesion
关键词 胶粘剂 无卤 阻燃 挠性覆铜板(FCCL) adhesive halogen-free flame-retardant flexible copper clad laminate (FCCL)
  • 相关文献

参考文献8

  • 1辜信实.印制电路用覆铜箔层压板[M]北京:化学工业出版社,2002389-401.
  • 2张道智;沈里正.电子构装用绿色无卤材料技术之近况发展之挑战[J]工业材料(台湾),2007(251):89-97.
  • 3刘生鹏;茹敬宏;伍宏奎.一种无卤阻燃环氧树脂组合物、使用其制作的挠性覆铜板及其制作方法:[P],CN101280093.
  • 4Shingo Kaimori,Jun Sugawara,Akira Mizoguchi. Adhesive resin compositions,and laminates and flexible printed wiring boards using same:[P].US,20110303439,.
  • 5Kazunori Kondo,Shigehiro Hoshida,Tadashi Amano. Flame retardant adhesive composition,and adhesive sheet,coverlay film and flexible copper clad laminate using same:[P].US,7820741,.
  • 6张春玲,那辉,牟建新,于文志,付铁柱,仉新功,李子传,吴忠文.含联苯结构的环氧树脂固化性能的研究[J].高等学校化学学报,2004,25(9):1756-1758. 被引量:18
  • 7刘生鹏,茹敬宏,盖其良.挠性覆铜板用环氧胶粘剂的咪唑固化促进剂的优选研究[J].绝缘材料,2007,40(3):15-17. 被引量:2
  • 8欧育湘.实用阻燃技术[M]北京:化学工业出版社,200288-91.

二级参考文献14

  • 1李非,姚兴芝,王西新.1-(β-氰乙基)-2-甲基咪唑的合成及性能研究[J].南阳师范学院学报,2005,4(6):52-54. 被引量:3
  • 2张健,韩孝族.液体橡胶增韧环氧树脂/咪唑体系的形态与力学性能[J].应用化学,2005,22(12):1333-1337. 被引量:24
  • 3Lin Ching Hsuan, Huang Jung Min, Wang Chun-Shan. Polymer[J], 2002, 43(10): 2959-2967
  • 4Su W. F. A. , Chuang Chih-Min. Journal of Applied Polymer Science[J], 2002, 85(11): 2419-2422
  • 5Su Wei-Fang, Lee Yin-Chuang, Pan Wei-Ping. Thermochimica Acta [J], 2002, 392:395-398
  • 6Su W. F. A. , Schoch K. F. , J. Smith. D. B.. Journal of Applied Polymer Science[J], 1998, 70(11): 2163-2167
  • 7ZHANGChun-Ling(张春玲) NAHui(那辉) LIUChen-Guang(刘晨光)etal.Thermosetting Resin(热固性树脂),2002,17(1):1-3.
  • 8Bobby Russell,Richard Chartoff.The Influence of Cure Conditions on the Morphology and Phase Distribution in a Rubber-modified Epoxy Resin Using Scanning Electron Microscopy and atomic Force Microscopy[J].Polymer,2005 (46):785-798.
  • 9Shinn-Gwo Hong,Chau-Kai Chan.The Curing Behaviors of the Epoxy/Dicyanamide System Modified with Epoxidized Natural Rubber[J].Thermochimica Acta,2004 (417):99-106.
  • 10石宁.高性能环氧树脂的开发和应用趋势[J].热固性树脂,2000,15(2):30-33. 被引量:14

共引文献18

同被引文献23

引证文献2

二级引证文献6

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部