动态蚀刻补偿法在减成法板上的应用

The application of dynamic etch compensation in subtractive process board

采用DES线制作PCB外层线路时,线宽精度影响因素主要有表面铜厚度及铜厚均匀性、蚀刻均匀性/稳定性、线路密集程度差异、菲林补偿差异等。首先对DES线设备、工艺参数优化;其次在设备参数正常条件下研究发现当表面铜厚均匀性相同时,表面铜厚越厚则线宽差距越大,即铜厚每相差10 m则线宽相差10 m^20 m;然后深入研究发现68.6 m表面铜厚的密集线、孤立线线宽差异约25.4 m。最后确立密集线、孤立线差异的消除方法为"引入Genesis2000的动态蚀刻补偿功能对菲林补偿优化";并通过批量验证其补偿法则是准确的及使用该软件是可行的、有效的,提高了酸性蚀刻制作外层减成法板线宽精度。

While using DES line to fabricate outer circuit,main factors which influence outer line-width,are： diversity and uniformity of surface copper thickness,diversity of circuit density,compensation of artwork film,uniformity/stability of etch process etc.If surface copper uniformity is consistent,the line-width difference gradually becomes wide while surface copper thickness increases,the difference of line-width is up to 10 m ~ 20 m if copper thickness increases by 10 m.Even though optimizing the DES parameter,the difference between dense line and isolated line is up to 1.0 mil.In order to solve this problem,the dynamic etch compensation function of Genesis2000 is introduced to optimize compensation of artwork film.This function is proved to be effective and accurate through the small trial results and mass production case.Finally Cap of line-width raises to 3.