高导热板材PCB产品开发

High thermal conductivity laminate PCB product development

随着电子设备不断将更强大的功能集成到更小组件中,温度控制已经成为设计中至关重要的挑战之一,即在架构紧缩,操作空间越来越小的情况下,温度已成为影响设备可靠性最重要的因素,如何有效地带走更大单位功率所产生的更多热量是亟待解决的问题。正是从PCB材料角度出发,研究高导热板材的PCB加工过程,以及其对PCBA热量散发带来的变化。

As electronic devices continue to have more powerful features within smaller size,the temperature control has become critical to one of the challenges in the design,namely,tight structure,operation of space smaller and smaller cases,the temperature has become the most important factor in equipment reliability.How to effectively take away the heart from a larger unit of power generated a serious problem.This article is from the perspective of PCB material to study the high thermal conductivity of the PCB board process and their impact on the changes brought about PCBA heat distribution.