不同条件下化学镍钯金的可焊性研究

The study on solderability of ENEPIG under different conditions

可焊性是印制电路板组装产品极重要的性能之一。文章讨论了化学镍钯金(ENEPIG)的可焊性,首先对化学镍金(ENIG)和化学镍钯金的特点进行了对比,然后通过实验对影响产品焊接的可能因素进行了验证,得出钯层的有效控制能解决化学镍钯金的可焊性问题。

Solderability is one of the most important properties of PCB assembled products.This paper aims to discuss the solderability of ENEPIG.Firstly,it makes a comparison of properties of ENIG and ENEPIG.Secondly,it verifies the potential factors that may influence welding through experiments.And then a conclusion can be made that the problems of solderability of ENEPIG can be solved by effectively controlling palladium layer.