基于毫米波的邦定线互连分析与补偿结构

Analysis and Optimization of Wire-bonding Interconnect Characteristics in Millimeter-wave Band

Wire bond(邦定线)是固态毫米波系统的常用互连结构。邦定线寄生电感大,在毫米波频段,为了降低邦定线的感性失配对传输性能的影响,对邦定线的结构进行了建模仿真和特性分析;并在基板上设计阻抗补偿结构。通过增加短截线匹配结构优化了毫米波邦定线互连结构的性能,使得该结构在65 GHz～80 GHz频率范围内反射损耗小于-10 dB,插入损耗小于-1 dB。

Wire-bonding has been widely used for physical interconnections between the millimeter-wave dies and substrates.However,when operating frequency increases to the millimeter-wave band,the parasitic inductance due to wire-bonding can cause impedance mismatch,which affects electrical transmission performance and hence the performance of the whole system.In order to minimize the transmission loss due to the inductance,different wire bonding configurations in the millimeter-wave band have been modeled,simulated and analyzed.A short stub wire-bonding compensation scheme is proposed to optimize the performance of the interconnect structure.By optimizing the structural parameters of this interconnection,an insertion loss less than-1 dB and return loss less than-10 dB has been achieved in a wide frequency band of 65 GHz ～ 80 GHz.