摘要
通过研究新一代封装设备的工况条件,根据高速高加速高精度的特点,设计一款应用于芯片封装方面由直线电机直接驱动的广义并联气浮定位平台结构,满足新一代的封装设备对定位平台的要求,同时为下一代封装设备的设计提供思路和方法,为相关研究工作的深入奠定了基础。通过有限元分析软件ABAQUS对定位平台进行静力学分析,分析和验证了平台结构的强度,同时对定位平台进行动力学分析,满足运动部件高刚度和质量最小化的要求。
According to the of high speed,high acceleration and high accuracy characteristic,a kind gas-lubricated positioning stage used in chip packages and directly driven by linear motors is designed to meet the requirements of the packaging equipments of the next generation,providing thoughts and methods for the design of the next generation of packaging equipment and being the deep foundation for the research work through the study of a new generation of packaging equipment operating conditions.In the stage,generalized parallel mechanism is used.Finite element analysis software ABQUAS is used to analyze the static characterizes of the stage so that the strength of the structure is analyzed and verified,and at the same time the stage achieves the requirement of the minimum quality of moving parts and ensures the high stiffness through the dynamic simulation.
出处
《机械设计与制造》
北大核心
2013年第4期137-140,共4页
Machinery Design & Manufacture
关键词
气浮平台
定位平台
有限元分析
Gas-Lubricated Stage
Positioning Stage
Finite Element Analysis
