摘要
采用扫描电镜(SEM)、X射线能谱仪(EDS)及X射线衍射仪(XRD)对钎焊用立方氮化硼CuNiTiIn系钎料的微观组织与性能进行综合分析。结果表明,CuNiTiIn系钎料由α-Cu固溶体、Cu-Ti化合物、In-Ni化合物及Cu-In化合物组成,随In含量的增加,化合物增多,钎料组织的枝晶倾向增大,钎料对立方氮化硼(c-BN)的润湿性提高,钎料的显微硬度增大;当In含量为3%时,钎焊接头的抗剪强度达到最大值。采用CuNi_5Ti_(10)In_3钎料钎焊C-BN颗粒,借助于能谱仪分析发现界面结合致密,形成化合物型界面,实现CuNi_5Ti_(10)In_3钎料与立方氮化硼(c-BN)的界面冶金结合。
The microstructures and mechanical properties of the CuNiTiln system filler metals for brazing c-BN(cubic boron nitride) were analyzed by scanning electron microscope,energy dispersion spectrometer and X-ray diffraction.The results showed that the microstructures of the CuNiTiln system filler metals were composed of a-Cu solid solutions,Cu-Ti,In-Ni and Cu-In compounds.The compounds increase,the dendrite orientation of the filler metals increases with the increasing of In.The improvement of wettability between filler metals and c-BN grains and the microhardness of the CuNiTiln system filler metals can be achieved with the increasing of In.When In content is 3%,the shearing strength of brazed joint reaches the maximum value.The brazing interface of c-BN grains with CuNi_5Ti_(10)In_3 filler metal is compact to form the compound type interface.The rnetallurgic bonding is realized in the interface between CuNi_5Ti_(10)In_3 filler metal and c-BN.
出处
《焊接》
北大核心
2013年第7期23-27,70,共5页
Welding & Joining
基金
高校青年基金项目(320110005)