无铅钎料钎焊不锈钢的试验研究

Lead-free brazing of stainless steel

研究了Sn-Ag-Cu系无铅钎料和Sn-Pb钎料对不锈钢的润湿性和钎焊接头抗剪强度,结果表明:无铅钎料对不锈钢的润湿性与Sn-Pb钎料相当;Sn-Ag-Cu无铅钎料与不锈钢的界面金相分析表明:无铅钎料与不锈钢的界面仅有少量FeSn_2金属间化合物生成,钎料中Ag含量对Sn基钎料与不锈钢的界面反应无影响,不锈钢软钎焊接头的强度主要取决于钎料的强度,随着钎料中Ag含量的升高,钎焊接头抗剪强度显著提高。

The soldering of stainless steel using Sn-Ag-Cu lead-free solder and Sn-Pb solder was studied.The wettability of the solder and shear strength of the joint were investigated.The results showed that,compared with the commercial Sn-Pb solder,the Sn-Ag-Cu lead-free solder shows nearly equal wettability on the stainless steel substrate.However,the joint soldered using Sn-Ag-Cu lead-free has higher strength.The interfacial metallographic analysis demonstrated that the content of Ag in the solder does not show obviously influence on the joint microstructure.The joint microstructure is consisted of FeSn_2 intermetallic compound.The mechanical tests showed that the joint strength primarily depends on the strength of solder.As Ag content in the solder increases,the strength of solder increases.As the result,the joint brazed using solder with high Ag content exhibits higher shear strength.