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基于单片机的H62银钎焊温度控制系统的设计 被引量:6

Design of H62 Silver Brazing Temperature Control System Based on MCU
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摘要 针对H62银钎焊过程温度难以控制的特点,设计了基于单片机的银钎焊温度控制系统。采用多个K型热电偶采集温度,采集的温度经MAX6675放大、冷端补偿、线性化后送入单片机进行处理,能实时显示输出温度并报警。实现了焊缝温度动态测量、监控及报警,避免了焊缝过烧造成的脱锌现象,解决了镀银件花斑质量问题。 According to the characteristics of difficulty of controling the temperature of H62 silver brazing process, the silver brazing temperature control system was designed based on MCU. The temperature was acquisitioned using multiple K type thermocouple , Acquisition temperature was put into a single chip for processing after amplification, the cold end compensation and linearization was treated by MAX6675. The output temperature was displayed by real-time and alarm. The welding temperature was measured dynamicly in monitoring and alarm. The dezincification caused by weld burning can be avoided. The quality problems of silver skewbald can be solved.
出处 《热加工工艺》 CSCD 北大核心 2013年第15期170-172,175,共4页 Hot Working Technology
基金 国家自然科学基金资助项目(NO.11105003)
关键词 银钎焊 热电偶 单片机 焊缝温度 :silver brazing thermocouple MCU welding temperature
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