期刊文献+

引信MEMS机构可靠性强化试验方法 被引量:4

Reliability Enhancement Test Technology of Fuze MEMS Mechanism
下载PDF
导出
摘要 MEMS机构具有体积小、批量生产、成本低等优点,非常适合引信的发展要求,但其可靠性问题限制了其应用且目前还没有标准化的可靠性试验方法。针对此现状,提出了将强化试验方法引入引信MEMS机构的可靠性研究。确定了可靠性强化试验的内容为温度循环、随机振动和冲击试验,分别参照GJB548B、GJB573A等国家军用标准设计了试验剖面。MEMS惯性开关试验结果表明:所设计的可靠性强化试验方法能够快速有效地激发惯性开关的潜在缺陷,暴露其薄弱环节,对下一步的改进工作具有指导意义。 MEMS mechanism has the advantages of miniaturization, capability of batch production and low cost, which meet fuze's developing requirement well, however, the reliability issues of MEMS restrict its appli- cation and it has no standardized testing method at present. Aiming at this situation, the reliability enhancement test was put forward in developing period. The thermal cycling test, vibration test and shock test were selected and their testing section were developed referring to GJB548B.GJPA73A and so on. The reliability enhancement tests of MEMS inertia switch indicated that the test method could arouse the potential defect quickly, revealed its weak points.
出处 《探测与控制学报》 CSCD 北大核心 2013年第3期41-45,共5页 Journal of Detection & Control
关键词 引信 MEMS机构 可靠性强化试验 惯性开关 失效模式 fuze MEMS mechanism reliability enhancement test inertia switch failure mode
  • 相关文献

参考文献4

二级参考文献26

  • 1徐春叶,刘善喜.LIGA工艺技术研究[J].集成电路通讯,2005,23(1):32-37. 被引量:4
  • 2闫冬,管欣,高振海.基于MEMS技术的微惯性传感器及在汽车上的应用[J].汽车技术,2006(2):1-6. 被引量:15
  • 3MICHAELIS S, TIMME H J, WYCISK M, et al. Additive electroplating technology as a post-CMOS process for the production of MEMS acceleration-threshold switches for transportation applications[J]. J. Micromech. Microeng., 2000, 10 (2): 120-123.
  • 4WHITLEY M R, KRANZ M, KESMODEL R, et al. Latching shock sensors for health monitoring and quality control[C]// 2005 Progress in Biomedical Optics and Imaging--Proceedings of SPIE, San Jose, CA, 2005, 1:185-194.
  • 5JIA Mengjun, LI Xinxin, SONG Zhaohui, et al. Microcantilever shocking-acceleration switches with threshold adjusting and on-state latching functions[J]. J. Micromech. Microeng., 2007, 17 (3): 567-575.
  • 6WYCISK M, TONNESEN T, BINDER J, et al. Low-cost post-CMOS integration of electroplated microstructures for inertial sensing[J]. Sensors and Actuators A, 2000, 83 (1-3): 93-100.
  • 7MA Wei, ZOHAR Y, WONG M. Design and characterization of inertia-activated electrical micro-switches fabricated and packaged using low-temperature photoresist molded metal-electroplating technology [J]. J. Micromech. Microeng., 2003, 13 (6): 892-899.
  • 8MATSUNAGA T, ESASHI M. Acceleration switch extended holding time using squeeze film effect for side airbag systems[J]. Sensors and Actuators, A: Physical, 2002, 100 (1). 10-17.
  • 9格雷戈里·科瓦奇.微传感器与微执行器全书[M].张文栋等译.北京:科学出版社,2003.
  • 10勃劳希JT.机械振动和冲击测量[M].沈小白等,译.上海:同济大学出版社,1993.

共引文献42

同被引文献26

引证文献4

二级引证文献8

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部