基于鼓包法的薄膜材料界面结合能的测定

Study on the Adhesion Strength of Film Based on Blister Test

薄膜材料的应用范围越来越广泛,薄膜材料的界面结合能对其使用过程具有重要影响。鼓包法是测量薄膜材料界面结合能的一种重要的方法。通过有限元软件ABAQUS模拟鼓包实验,并用ABAQUS中的内聚力模型表征薄膜与基底之间的界面性能,最终得到薄膜材料的界面结合能。计算结果表明:薄膜开裂时的压强和挠度的乘积与界面结合能呈线性关系,且斜率随鼓包模型的孔径变化而变化。通过不同孔径下的模拟最后得到Ni薄膜界面结合能的表达式,且表达式中的参数在实验过程中简单易测。

The film is more and more widely used now, and the adhesion strength has great influence on the ap- plication of films. The blister test is one of most important method to measure the adhesion energy of the filrrL So ABAQUS was used to simulate the blister test. In the simulation, a built-in cohesive zone model of ABAQUS was used to present the interface performance that between the film and substrate. At last the adhesion strength was ob- tained through the simulation. The results showed that, the adhesion strength has linear relationship with the product of pressure and deflection. The slope changes with the diameter of the hole. Finally, the expression of adhesion strength for Ni film though the simulation under different model was derived, and the parameters in the expression were easy to get in experiment.