硅片切割废砂浆中去除硅和二氧化硅工艺的研究

Research on Removing Silicon and Silicon Dioxide from the Cutting Waste Slurry of Silicon Wafer

本文主要研究用碱洗法去除硅片切割废砂浆中硅和二氧化硅等杂质,以获得高纯度的碳化硅。研究了碱液的种类、碱液的浓度、碱液与总硅的配比、反应时间和反应温度各因素对除硅效果的影响,通过正交实验得出了最优的工艺条件。

The silicon, silicon dioxide and other impurities were removed from waste mortars using alkali washing method. The effects of the type and concentration of alkali solution, the ratio of alkali solution and total silicon, reaction time, reaction temperature on the result of removing impurities were studied. The best processing technology was obtained by the orthogonal experiment. The optimized process has high recovery efficiency.