Cu/Mg连接界面扩散行为研究

Investigation of diffusion behavior of interfacial bonded copper and magnesium

采用界面真空扩散工艺,研究了黄铜和纯镁接触界面元素扩散行为。利用SEM和EDS对界面的显微组织和元素扩散的行为进行了研究。结果表明,镁元素向铜基体中扩散趋势明显,铜元素基本没有向镁基体中扩散,镁元素向铜基体中扩散约40μm。

Using the vacuum diffusion process, element diffusion behavior was studied of the interface of the copper and the pure magnesium. The interface was investigated for mierostructure and diffusion of elements by scanning electron microscopy （SEM） , Energy Dispersive Spectrometer（EDS）. Results from the experiment show that Magnesium element to the copper matrix diffusion trend obviously, copper basically not to magnesium matrix diffusion. Magnesium element to the copper matrix diffusion of about 40μm.