摘要
圆片级封装(Wafer Level Package)是近期快速崛起的创新性先进封装工艺。因其适应消费性电子产品对轻薄短小特性的需求,故而被市场广泛接受和推崇。本文将会介绍WLP的工艺流程和工艺控制,在可靠度上的挑战,和探讨圆片级封装的最新发展趋势。
Wafer Level Package ( WLP ) is one of the fastest growing segments in the advanced package industry. It is gaining popularity and promotion for its small form factor which meets miniaturization requirements of consumer electronics. This paper will WLP board level reliability introduce the WLP process flow and process control accordingly; review the challenges in ( BLR ) ; and investigate the roadmap of WLP development.
出处
《中国集成电路》
2013年第9期59-62,共4页
China lntegrated Circuit
关键词
圆片级封装
重布线层
板级可靠性测试
Wafer Level Package ( WLP )
Redistribution Layer ( RDL )
Board Level Reliability ( BLR ) Test