摘要
研究了光电集成器件的耦合与封装的关键技术,首先分析光纤与PLC波导的z向偏移及角度偏移与耦合效率的关系,发布其3dB容差分别为70μm及5°以内,并分析存在8°反射角及填充折射率匹配胶时耦合情况并仿真验证。该器件采用表面贴光子技术、无源对准、非气密封装实现光与电、有无源的多功能结合。测试了器件的激光器与探测器性能,测试结果表明,该光电集成器件边模抑制比、灵敏度等参量优良。
Coupling and package technologies of opto-electronic integrated device are mainly introduced in this paper. First- ly, the relationship between coupling efficiency and offsets(including z offset and angle offset) of optical fiber and the waveguide is analyzed. Through theoretical calculation and simulation curve fitting, the 3 dB tolerance of z offset is 70 tzm, 3 dB tolerance of the angle offset is less than 5~. And the coupling condition in the presence of 8~ reflected angle and with the filled refractive index matching gel are compared and shown in this paper as well. Then it outlines that this device can realize optoelectronic integration, active and passive integration and multi-function integration by using three key technologies -- surface mounted photonics, passive alignment and non-hermetic package. At last, the device samples are tested and the re- sults show that the SMSR and sensitivity of the integrated optical device are great and stable.
出处
《光学与光电技术》
2013年第4期86-90,共5页
Optics & Optoelectronic Technology
基金
国家863计划(2011AA010304)资助项目
关键词
集成光学
光电集成器件
光纤与波导耦合
菲涅尔反射
光纤到户
integrated optics
opto-electronic integrated devices
coupling of fiber and waveguide
Fresnel reflection
FTTH