摘要
文中通过研究MEMS(微机电系统)加速计在SOIC封装(小外形集成电路封装)下的特性,针对MEMS芯片断裂故障的原因分析了影响PPM(百万分比的缺陷率)性能的主要封装工艺步骤。其中感应单元固晶胶的硬度是引起芯片断裂的主要参数,通过反向工程确定了可以同时满足感应单元固有频率和封装可靠性要求的固晶材料。在试验中采用固晶胶E后,MEMS加速计的SOIC封装呈现出更加强韧的特性。此研究对于改善MEMS加速计的PPM性能有一定参考价值。
The paper studied the characteristic of MEMS （microelectromechanical systems） accelerometer in SOIC package, it analysed the main packaging process steps which affect the PPM based on the reason of MEMS chip fracture failure. Induction unit solid crystal glue hardness is the main parameters which cause chip fracture, by reverse engineering, solid crystal material which can meet both the induction unit natural frequency and package reliability requirements can be confirmed. Test using a solid crystal glue E, the MEMS accelerometer SOIC package showing a more robust features. This study has some reference value for improving MEMS accelerometer PPM.
出处
《电子与封装》
2013年第8期5-8,共4页
Electronics & Packaging
