摘要
随着相控阵雷达技术的发展,大规模应用了裸芯片等能够减小组件体积、减轻组件重量的精密元器件。然而这些元器件在基板贴装元器件的微组装过程中,容易在采用常规清洗手段产生的机械力作用下损伤,需要寻找无损的清洗手段。而气相清洗以其无机械力作用、无振动的特点正在受到越来越多的关注。文中以实际生产中组件内常见污染物为例进行气相清洗,并对清洗效果进行了评价和分析。
With the development of phased array radar technology, bare chip （die） as one of the precision components has large-scale application because it able to reduce module size and weight. However, die was easy to be damaged by the mechanical force or vibration. So it needs to find a nondestructive means of cleaning in the micro-assembly process of the substrate mount components. Because of operation without mechanical force and vibration, gas cleaning has being more and more attention. In this paper, we used gas cleaning in the actual production assembly for common contamination, and then evaluated and analyzed the cleaning effect.
出处
《电子与封装》
2013年第8期9-13,共5页
Electronics & Packaging
基金
国防基础科研项目(A1120132016)
关键词
气相清洗
溴丙烷
无损
污染物
gas cleaning
bromopropane
nondestructive
contamination
