摘要
针对影响功率器件可靠性的各种因素,重点阐述了粘片气泡对可靠性的影响,分析了粘片气泡的形成机理,提出了减少粘片气泡的新工艺技术,测试表明,新工艺技术的应用明显减少了粘片气泡,效果良好。
According to the various factors affecting the reliability of power devices, the paper elaborated the influence of the air bubbles on the reliability in the die bonding process, analyzed the formation mechanism of the air bubbles while the die bonding, and presented the new technology for the die-bonding air bubbles reducing. It is demonstrated that the application of the new technology has significantly reduced the die-bonding air bubbles and good results are achieved after the bonded dies are tested.
出处
《机电工程技术》
2013年第8期126-128,171,共4页
Mechanical & Electrical Engineering Technology
关键词
功率器件
粘片
气泡
可靠性
power devices
die bond
air bubble
reliability
