摘要
针对300 mm单晶片清洗设备,设计开发了一套化学药液温度控制系统。由于化学药液传输系统具有大惯性、大时滞、非线性的特点,采用Smith预估法设计了一种温度控制算法;并基于可编程计算机控制器(PCC)设计实现了化学药液温度控制系统。介绍了该控制系统的硬件组成和控制算法设计,实验结果表明该温度控制系统能够满足清洗工艺需求。该系统现已成功应用于自主研发的300 mm、65 nm铜互连单片清洗设备。
A chemical temperature control system is developed for a 300 mm single wafer cleaning system. Due to the inertia, long time delay, nonlinear properties of the chemical delivery system, a temperature control method based on Smith prediction algorithm is designed. The control system is implemented based on Programmer Computer Controller （PCC）. The hardware system and control algorithm of the control system are introduced in this paper. Experiment results show this system can meet the process requirements. And the system has been applied on 300 mm 65 nm copper-interconnection single wafer cleaning system successfully.
出处
《电子工业专用设备》
2013年第8期30-34,70,共6页
Equipment for Electronic Products Manufacturing
关键词
化学药液传输系统
温度控制
Smith预估法
清洗设备
Chemical Delivery System
Temperature Control
Smith prediction algorithm
Cleaningequipment
