温度与镀层对Sn-Zn-Ga-Nd钎料润湿性能的影响

Effect of temperature and coatings on the wettability of Sn-Zn-Ga-Nd lead-free solder

采用润湿平衡法测定了不同试验温度下Sn-Zn-Ga-Nd无铅钎料在纯锡、SnBi和Au/Ni三种镀层上的润湿时间和润湿力,研究了钎焊温度对钎料在不同镀层上润湿性能的影响.结果表明,钎料的润湿性能随着温度升高而提升,表现为润湿时间缩短,润湿力增大;在240℃时,Sn-Zn-Ga-Nd无铅钎料在三种镀层上的润湿时间均已满足电子行业标准IPC中t0≤1 s的要求,其中纯锡和SnBi镀层的综合润湿性能更好.

The wetting time and wetting force of Sn-Zn-Ga-Nd lead-free solder on Sn,SnBi,Au/Ni coatings under different temperatures were measured,and the effect of soldering temperature on the wettability of solders on different coatings was investigated.The results indicate that with the increase of temperature,the wetting time reduced and the wetting force increased evidently.At 240 ℃,the wetting time for three coatings all met the needs of IPC standard in which the wetting time t0≤1 s at wave soldering.On the other hand,the wettability of the solder was better on Sn/Cu and SnBi/Cu substrates than on Au/Ni/Cu substrate.