摘要
介绍了利用计算机扫描技术与图形处理技术对印制电路板图形电镀铜箔面积进行计算的原理与方法 。
Introduce the principle and method of computing the plating copper area of Printed Circuit Board(PCB) by computer scanning technology and graphic disposing technology. And an simple explanation about the application of the program BMP2AREA is given.
出处
《电子工艺技术》
2000年第6期242-243,共2页
Electronics Process Technology
关键词
计算机扫描
图形处理
印制电路板
菲林扫描
铜箔
Computer scanning technology
Graphic disposing technology
Printed Circuit Board (PCB)
BMP2AREA program
