摘要
随着配备且ＥＥＥ１３９４接口的设备的增加，自１９９９年下半年起，ＩＥＥＥ１３９４接口用ＬＳＩ的价格开始大幅度下降。链路层ＬＳＩ正积极引入防复制技术并向定制化方向发展；物理层ＬＳＩ的目标则主要是实现低功耗化。此外，一些主要的半导体制造商的开发重点已瞄准了面向下一代标准——Ｐ１３９４ｂ的ＬＳＩ。
From the latter half of the year 1999, the prices of the LSIs for IEEE1394 interface have dropped substantially along with the increase of the machines equipped with IEEE1394 interface. The link layer LSIs are actively adopting the copy protection technology and are moving in the direction of customization; the goal of the physical layer LSIs is mainly the realization of lower power consumption. Besides, the focal point of the work of some semiconductor manufacturers have been put on the development of the next generation standard-P1394b-oriented LSIs.
出处
《微电子技术》
2000年第5期1-8,共8页
Microelectronic Technology
