电镀Cu-Mo-Co合金的热力学分析

Thermodynamic Alalysis of Electrodeposited Cu-Mo-Co Alloys

开发电镀无银铜合金镀层将是铜基电接触材料开发的重点之一。利用常温下的Cu、Mo和Co水溶液体系的φ-pH图,从热力学角度分析Cu-Mo-Co合金镀层/铜基体的可行性。结果表明,在Cu2+、Co2+的水溶液中,Cu-Co能在热力学稳定区域发生共沉积。在Cu2+、MoO42-水溶液中,Cu-Mo合金不能析出。但在Ni2+、MoO42-水溶液中,Co-Mo合金能诱导析出。因此,电镀Cu-Mo-Co合金是可能的。

The eletrodeposited copper alloy coating without silver element on the copper substrate will be one of the emphases on the exploitation of copper based electrical contact materials. By analyzing the po- tential-pH diagram of Cu, Co and Mo aqueous solution system at normal temperature, the feasibility of Cu- Mo-Co alloy coating on copper substrate is thermodynamically determined. The results showed that Cu-Co alloys could be depsoited in the aqueous solution of Cu2＋ and Co2＋. In the aqueous solution of Cu2＋ and MoO42- ,Cu-Mo alloys can not be electrodeposited. But Cu-Mo alloys can be inductively electrodeposited in the aqueous solution of Co2＋ and MoO4^2-. So it is feasible that Cu-Mo-Co alloys could be electrodepos- ited in aqueous solution.