EDTA在化学镀铜中的应用

Application of EDTA in Electroless Copper Plating

以EDTA为配体,CuSO4·5H2O为主盐,次磷酸钠为还原剂,对铸铁基体表面化学快速镀铜进行了研究,确定的镀液的组成为:7.5g/L CuSO4.5H2O,20 g/L EDTA,38 g/L次磷酸钠,37 g/L四硼酸钠,15g/L柠檬酸三钠,0.5g/L硫酸镍,0.2mg/L硫脲,0.05g/L脂肪醇聚氧乙烯醚(O-20)。最佳工艺条件θ为65℃,pH=8.3,t为40min。结果表明,在上述条件下铸铁基体表面形成的铜镀层光亮度良好,镀层均一,纯度高,显著提高了镀层质量。

The fast electroless copper plating was carried out on the cast iron substrate by using EDTA as ligand,CuSO4 ·5H2O as main salt and sodium hypophosphite as reducing agent. The composition of plat- ing bath was determined as followed ：7.5 g/L of CuSO4 ·5H2O,20 g/L of EDTA,38 g/L of sodium hypo- phosphite,37 g/L of sodium tetraborate, 15 g/L of sodium citrate,0.5 g/L of nickel sulfate,0.2 mg/L of thiourea and 0.05 g/L of 0-20 （ fatty alcohol-polyoxyethylene ether）. The optimal plating conditions were obtained as the temperature of 65 ℃, pH value of 8.3 and the plating time of 40 min. The result shows that the copper plating formed on the cast iron was in a better brightness, uniformity and purification. And the quality of copper plating was significantly improved.