金属间化合物提高陶瓷接头高温性能的作用

HEAT-RESISTANT Si_3N_4 CERAMIC JOINTS WITH INTERMETALLIC COMPOUNDS FORMED IN SITU

研究了连接过程中通过原位形成金属间化合物来提高 Ｓｉ_３Ｎ_４陶瓷接头高温性能的可能性、研究了用 Ｔｉ／Ｎｉ／Ｔｉ多层中间层在 １０００—１１５０℃ｔ温度范围内以过渡液相连接 Ｓｉ_３Ｎ_４陶瓷时 Ｔｉ和 Ｎｉ层厚度、连接时施加的压力以及连接温度与保温时间等因素对接头组织和强度（包括室温和高温强度）的影响规律．结果表明，在合理控制连接工艺和中间层金属厚度的条件下，可以通过原位形成金属间化合物获得室温和高温强度均较好的接头，８００ ℃时接头的剪切强度可保持 ８８

The possibility of the heat--resistant Si_3N_4 ceramic joints with intermetallic compounds formed in situ was investigated. The Si_3N_4 ceramics were joined with Ti/Ni/Ti multi-interlayers within 1000-1150℃. The effects of various parameters, which include the thickness of Ti and Ni foils, the pressure imposed during bonding, the bonding temperature and the holding time, on the microstructures and the strength (both at room temperature and at high temperature) of the joints were studied. The results indicated that the sound joints with higher strength both at room temperature and at elevated temperature could be acquired with intermetallic compounds formed in situ under appropriate bonding parameters. The shear strength at 800 ℃could sustain about 88 MPa.