介质覆盖的柱面共形微带天线的互耦分析

Analysis of Mutual Coupling of Superstrate-Loaded Cylindrical-Rectanular Microstrip Antennas

共形微带天线间的互耦对微带天线阵的性能有重要影响 ,另一方面 ,为了防止对微带天线阵的自然的或人为的损害 ,需要在天线阵表面涂覆介质层或给其加上天线罩 ,因此在设计共形微带天线与阵列时也应当考虑覆盖层或天线罩的影响 .利用严格的全波法分析和计算了介质覆盖、探针馈电的柱面共形微带天线单元间的互耦 ,给出了E面和H面互耦的数值结果 ,并讨论了柱面曲率半径和贴片间距对互耦的影响 ,给出了互耦随频率的变化关系 ,同时也研究了衬底介质和覆盖层对互耦的作用 .

The mutual coupling between microstrip antenna elements has affected the performances of microstrip arrays, on the other hand, substrate cover or superstrate loaded on microstrip arrays is necessary to prevent the damage of nature or man made. The effect of substrate cover should be considered when we design conformal microstrip antenna and arrays. This paper proposes an analysis and computation of mutual coupling of superstrate loaded cylindrical rectangular microstrip antennas fed by coaxial probe by using rigorous full wave method. The calculation results about mutual coupling of E and H plane are given. The variations of the mutual coupling with curvature of cylinder, the spacing between microstrip elements and frequency are discussed. The coupling with different grounded dielectric substrate and superstrate are analyzed simultaneously.