高集成电路模块的高速空气射流冷却技术研究

Study on High Velocity Air-jet Cooling of Compact Integrated Circuits

高集成电路模块具有结构紧凑、组装密度大、体积热流密度高、热设计空间小的特点,无法采用常规风冷或常规液冷的冷却方式。针对这一特点,文中提出了一种高速空气射流冷却方法,并结合仿真与试验进行研究。结果表明,该冷却方式能够解决高集成电路模块的热设计问题,为其他类似电子器件的散热问题提供了参考。

Compact integrated circuits have the characteristics of compact structure, high heat-flux density and very limited space for thermal design, which makes regular cooling methods such as air cooling and liquid cooling not applicable. In this article, a high velocity air-jet cooling method for compact integrated circuits is presented, both numerical simulation and experimental study are carried out. The results show that the high velocity air-jet cooling method meets the demands of the thermal design of compact integrated circuits, and provides a reasonable reference for the cooling design of similar electronic devices.