摘要
半导体表面钝化方法很多,但使用最广泛的是PSG膜.本文将着重讨论PSG膜钝化机理、膜的厚度及其磷含量的设计和控制.
The method of semiconductor surfaces passivation have much,but PSG films widely used.in this poper, emphasizing mechanism of passivtion and design and control of films thichness and phosphorus can be incorporated in oxides
出处
《电子器件》
CAS
1991年第1期51-54,50,共5页
Chinese Journal of Electron Devices